Our park machines and our wide experience in the field are your guarantee for a rapid service of high quality for the sawing of  your wafers and substrates.

4 sawing machines up to 8 inches diameter.

Wafers mounting on adhesive or UV film.

Material: Silicon, GaAs, Ceramic, Glass, Sapphire,…

Sawing speed up to 80mm/s.

Blade spindle speed : 60 000 rpm.

Kerf accuracy: 5 microns.

HCM.SYSTREL

La Rochelle: Tel 33 (0)5 46 45 12 70 
Les Ulis: Tel 33 (0)1 69 07 80 39 
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